Items | Layer | Thickness | Line width/space | min Aperture | Tolerance in Aperture | Aspect Ratio | min W/B pads | W/B width pads | Resign Flow | CVL Offset | PSR Offset | ENEPIG | Forming Dimensional Accuracy | EMI Offset | SUS Offset | Flatness |
Capabilities | 4-12L | 0.21-2.0mm | inner layer: 30/35um； out layer: 50/50um | 0.05mm | PTH：±0.076mm NPTH：±0.05mm | ≤8 (through-hole)； ≤1 (Blind hole) | 0.1*0.15mm | ±0.03mm | Max 0.3mm | ±0.10mm | ±25um | Au: min. 0.05um Pd: min. 0.05um Ni: min. 2.5um | ±0.05mm | ±0.15mm | ±0.075mm | Reflow front≤30um； Reflow after≤40um |
Items | Layer | Material | Thickness | Size of Working Panel | Line width/space | Superposition Accuracy | min Aperture | Aperture | Drilling | Aspect Ratio | PSR Offset | min Width of PSR Bridge | Forming Dimensional Accuracy | Tolerance in Thickness | Warpage |
Capabilities | 2-18L | Normal TG/ High-TG/HF /Pb-free | 0.23-2.5mm | 600*500mm | inner layer: 30/35um； out layer: 50/50um | ±0.076mm | 0.1mm | PTH：±0.076mm NPTH：±0.05mm | ±0.05mm | ≤12 (through-hole)； ≤1 (Blind hole) | ±25um | Green：0.08mm Black：0.10mm | ±0.1mm | T≤0.5mm：±0.05mm 0.5mm＜T＜1.0mm：±0.08mm T≥1.0mm：±10% | ≤0.5% |
Items | Materials | min Aperture | Aspect Ratio | Plug | Via/ Surface Copper Thickness | min Line Width | min BGA Pitch | PSR Offset Tolerance | DAM | Surface Treatment | Forming Dimensional Accuracy | Warpage | X-Out | Sizing Control |
Capabilities | Doosan: 7409HG_B G type SHENG YI: SI10U(S) | Mechanical drilling (MD)：min0.1mm UV drilling(LVH)：min0.04mm | through-hole(PTH)：≤8 Blind hole(HDI)：≤1 | PSR Fill Resin Fill Copper Fill | min10um | 30/30um | 0.3mm | 25um | Green：min0.075mm Black：min0.09mm | ENIG ENEPIG Soft/ Hard Gold | 0-100mm：±0.1mm 100-150mm：±0.12mm ＞150mm：0.15mm | Max0.7% | 20% | ±0.03% |
Items (Unit:um) | 2025 | 2026 | |||
Standard | Advance | Standard | Advance | ||
Min. Trace/Space | Inner layer | 35/35(12um) | 30/35(12um) | 30/35(12um) | 30/30(9um) |
Outer layer | 50/50(25um) | 45/45(25um) | 50/50(25um) | 45/45(20um) | |
Min. Laser Via Diameter | 75 | 75 | 75 | 70 | |
Min. Laser Land | D+140 | D+130 | D+130 | D+120 | |
Min. Drill Size | 100/50(UV) | 100/40(UV) | 100/40(UV) | 100/40(UV) | |
Min. PTH Pad Size (Tenting) | D+160 | D+160 | D+150 | D+140 | |
Min. BGA Pitch | 380 | 360 | 350 | 300 | |
Max. PTH Aspect Ratio PCB | 9:01 | 10:01 | 9:01 | 10:01 | |
Max. PTH Aspect Ratio R&F PCB | 5:01 | 7:01 | 5:01 | 7:01 | |
Max. Laser Via Aspect Ratio | 0.7 | 0.8 | 0.7 | 0.8 | |
Max. Total Layer (PCB/FPC) | 14/4 | 18/8 | 18/8 | 18/8 | |
Max. Total Layer (R&F PCB) | 6 | 12 | 8 | 12 | |
D/F Registration | 45 (CCD) | 25 (DI) | 45 (CCD) | 25 (DI) | |
Min. D/F Resolution (12um/25um) | 35/40 | 30/35 | 30/40 | 25/35 | |
S/M Registration | 45 (CCD) | 25 (DI) | 45 (CCD) | 25 (DI) | |
Min. S/M Open | 190 | 140 | 190 | 140 | |
CNC/UV Registration | 100/50 | 80/30 | 80/30 | 80/20 | |
Impendance Control | ±10% | ±8% | ±10% | ±8% | |
实时准确跟踪生产计划以及订单执行状态。
实时准确了解各个工序的在制品信息以及瓶颈工序。
实时监控设备运行状态以及设备异常报警。
实时准确了解车间、工序品质信息，并对品质异常进行及时报警。
