Items | Layer | Thickness | Line width/space | min Aperture | Tolerance in Aperture | Aspect Ratio | min W/B pads | W/B width pads | Resign Flow | CVL Offset | PSR Offset | ENEPIG | Forming Dimensional Accuracy | EMI Offset | SUS Offset | Flatness |
Capabilities | 4-16L | 0.21-2.0mm | inner layer: 35/35um； out layer: 50/50um | 0.1mm | PTH：±0.076mm NPTH：±0.05mm | ≤8 (through-hole)； ≤1 (Blind hole) | 0.1*0.15mm | ±0.03mm | Max 0.3mm | ±0.15mm | ±35um | Au: min. 0.05um Pd: min. 0.05um Ni: min. 2.5um | ±0.1mm | ±0.15mm | ±0.1mm | Reflow front≤30um； Reflow after≤40um |
Items | Layer | Material | Thickness | Size of Working Panel | Line width/space | Superposition Accuracy | min Aperture | Aperture | Drilling | Aspect Ratio | PSR Offset | min Width of PSR Bridge | Forming Dimensional Accuracy | Tolerance in Thickness | Warpage |
Capabilities | 2-20L | Normal TG/ High-TG/HF /Pb-free | 0.23-2.5mm | 600*500mm | inner layer: 35/35um； out layer: 50/50um | ±0.076mm | 0.1mm | PTH：±0.076mm NPTH：±0.05mm | ±0.05mm | ≤12 (through-hole)； ≤1 (Blind hole) | ±35um | Green：0.08mm Black：0.10mm | ±0.1mm | T≤0.5mm：±0.05mm 0.5mm＜T＜1.0mm：±0.08mm T≥1.0mm：±10% | ≤0.5% |
Items | Materials | min Aperture | Aspect Ratio | Plug | Via/ Surface Copper Thickness | min Line Width | min BGA Pitch | PSR Offset Tolerance | DAM | Surface Treatment | Forming Dimensional Accuracy | Warpage | X-Out | Sizing Control |
Capabilities | Doosan: 7409HG_B G type SHENG YI: SI10U(S) | Mechanical drilling (MD)：min0.1mm UV drilling(LVH)：min0.05mm | through-hole(PTH)：≤8 Blind hole(HDI)：≤1 | PSR Fill Resin Fill Copper Fill | min10um | 35/35um | 0.3mm | 30um | Green：min0.075mm Black：min0.09mm | ENIG ENEPIG Soft/ Hard Gold | 0-100mm：±0.1mm 100-150mm：±0.12mm ＞150mm：0.15mm | Max0.7% | 20% | ±0.03% |
Items | 2023 | 2024 | |||
Standard | Advance | Standard | Advance | ||
Min. Trace/Space | Inner layer | 50/50 | 40/40 | 40/40 | 35/35 |
Outer layer | 60/60 | 50/50 | 50/50 | 40/40 | |
Min. Laser Via Diameter | 80 | 75 | 75 | 70 | |
Min. Laser Land | D+180 | D+170 | D+180 | D+160 | |
Min. Drill Size | 100/50(UV) | 80/50(UV) | 80/50(UV) | 80/40(UV) | |
Min. PTH Pad Size (Tenting) | D+180 | D+170 | D+180 | D+160 | |
Min. BGA Pitch | 400 | 350 | 380 | 350 | |
Max. PTH Aspect Ratio | 10:1 | 15:1 | 10:1 | 15:1 | |
Max. Laser Via Aspect Ratio | 0.8 | 1.0 | 0.8 | 1.0 | |
Max. Total Layer | 20 | 24 | 20 | 24 | |
D/F Registration | 50 | 30 | 45 | 25 | |
Min. D/F Resolution | 45 | 40 | 40 | 35 | |
S/M Registration | 50 | 30 | 45 | 25 | |
Min. S/M Open | 200 | 140 | 190 | 140 | |
Max. Panel Size | 500*420 | 500*430 | 500*435 | 500*440 | |
Impendance Control | ±10% | ±8% | ±10% | ±8% | |
实时准确跟踪生产计划以及订单执行状态。
实时准确了解各个工序的在制品信息以及瓶颈工序。
实时监控设备运行状态以及设备异常报警。
实时准确了解车间、工序品质信息，并对品质异常进行及时报警。
