 |
Part Number | A118RGQ445A |
Structure | 8L HDI+3, Stack Via, EMI |
Row Material | DSflex-600 |
Thickness | 0.39±0.05mm |
Laser/Buried Hole | YES |
min. Buried Diameter/Land | 0.105/0.305mm |
Laser Diameter/Land | 0.075/0.25mm |
Min Line W/S | 0.06/0.04mm |
Stiffener | PI + SUS316L |
BGA Pitch | 0.35mm |
Solder Mask | PSR4000 MEH (Matt Black) |
Surface Treatment | ENIG |
Impedance | N/A |
