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Part Number | S886FGH376A |
Structure | 6L HDI+2, BVH, PTH, Stack Via |
Row Material | DSflex-600 |
Thickness | 0.35mm |
PTH Diameter/Land | 0.15/0.355mm |
Laser/Buried Hole | YES |
Laser Diameter/Land | 0.1/0.28mm |
min. Line W/S | 0.05/0.05mm |
Golden Finger | YES |
BGA Pitch | 0.4mm |
W/B Pitch | NO |
Solder Mask | Black |
Surface Treatment | ENIG |
Impedance | 90Ω±10% |
